Henkel
Henkel (www.henkel.com/electronics) has expanded its Multicore line of die-attach solder with Multicore DA101, which is designed for screen printing. According to Henkel, Multicore DA101 provides the thermal management necessary for smaller outline, higher functioning, semiconductor power devices, while also delivering the processability and versatility associated with solder-paste materials. Multicore DA101 is a flux system that is formulated to handle reflow with high-lead and lead-free alloys and withstand temperatures of 572-626°F (300-330°C) for high-lead-reflow profiles and 464-518°F (240-270°C) for lead-free. Henkel notes that DA101 is an adaptable material that delivers excellent wetting ability to a variety of surfaces and reports that flux residues are exceptionally easy to clean with standard, off-the-shelf cleaning chemistries.
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