Henkel
Henkel (www.henkel.com/electronics) has developed Hysol ECCOBOND CA3556HF, a silver-filled, electrically conductive adhesive designed to offer fast cure at low temperature. The material is engineered for high-throughput production processes and applications that dictate high peel strength, such as the assembly of photovoltaic (PV) modules, automotive sensors, and membrane switches that incorporate temperature-sensitive substrates. Initially designed to address the unique requirements of the photovoltaic-module-assembly market, Henkel says Hysol ECCOBOND CA3556HF has been proven for other processes, such as crystalline-silicon (c-Si) and thin-film manufacturing.
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If you are in the electronic or solar power cell industry, then you know adhesives are required to keep everything together. Nevertheless lots of the materials used in the past are unable to supply the right solutions to those that have an interest in getting the right options. If you’re searching for a new solution, then the electrically conductive adhesive is a concept to consider for any project you are working with. USB wifi dongle